UF4007 1000V 1A DIODE DIP.
FEATURES
- Glass passivity chip junction.
- Ultrafast reverse recovery time.
- Low forward voltage drop.
- Low switching losses, high efficiency.
- High forward surge capability.
- Solder dip 275 °C max. 10 s, per JESD 22-B106.
- Material categorization: for definitions of compliance.
- Solder dip 275 °C max. 10 s, per JESD 22-B106.
- Material categorization: for definitions of compliance.
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